Abstract: Abstract：Clay bonded silicon carbide products are prepared with silicon carbide and silica
powder as the main raw materials and clay as the binder. The influence of different moulding
pressures（100 MPa，150 MPa，180 MPa，200 MPa，and 230 MPa）and particle grading on
the microstructure and properties of silicon carbide products are studied. The results show that
when 17% silicon carbide fine powder is added，the bulk density value is 2.42 g/cm3，and the
room temperature compressive strength and flexural strength are 83.46 MPa and 17.4 MPa，
respectively； meanwhile，the oxidation resistance has been further improved. When the molding
pressure is 230 MPa，the mechanical properties and oxidation resistance of the pressed samples
reach their maximum values.

Key words: Silicon carbide material, Particle grading, Pressing pressure, Oxidation resistance